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Showing posts with label Qi Hardware Inc.. Show all posts
Showing posts with label Qi Hardware Inc.. Show all posts
Sunday, December 18, 2011
Wednesday, July 14, 2010
Reflash My Ben NanoNote with official debian
Finally I started to reflash my Ben as steps below: [The steps you can also follow here.]
1, Install xburst-tools
2, Choose one of the three methods below to re-flash the NAND. I chose using reflash_ben.sh -- easiest but least likely to work perfectly
$ cd /tmp/
/tmp$ wget http://projects.qi-hardware.com/media/upload/xburst-tools/files/xburst-tools_0.0+201004-0.1_i386.deb
--2010-07-14 13:49:37-- http://projects.qi-hardware.com/media/upload/xburst-tools/files/xburst-tools_0.0+201004-0.1_i386.deb
正在查找主機 projects.qi-hardware.com... 88.198.75.224
正在連接 projects.qi-hardware.com|88.198.75.224|:80... 連上了。
已送出 HTTP 要求，正在等候回應... 200 OK
長度： 49414 (48K) [application/x-debian-package]
Saving to: `xburst-tools_0.0+201004-0.1_i386.deb'
100%[======================================>] 49,414 37.6K/s in 1.3s
2010-07-14 13:49:39 (37.6 KB/s) -- 已儲存 ‘xburst-tools_0.0+201004-0.1_i386.deb’ [49414/49414])
$ sudo apt-get install --no-install-recommends libconfuse0
正在讀取套件清單... 完成
正在重建相依關係
正在讀取狀態資料... 完成
libconfuse0 已經是最新版本了。
以下套件是被自動安裝進來的，且已不再會被用到了：
linux-headers-2.6.31-17 scim-modules-table libboost-regex1.37.0 libboost-wave1.37.0 anthy
linux-headers-2.6.28-15 scim-chewing libboost-program-options1.37.0 scim-tables-zh libass1
libboost-thread1.37.0 libmysqlclient15off ruby1.8 ruby libboost-signals1.37.0
ttf-arphic-bsmi00lp libboost-graph1.37.0 libboost-iostreams1.37.0 ttf-arphic-gbsn00lp
libffado0 libphonon4 language-pack-zh-base scim-pinyin libgmyth0 liblrdf0
language-pack-gnome-zh-base libgraphicsmagick1 stardict-plugin-gucharmap
language-pack-kde-zh-base libboost-python1.37.0 linux-headers-2.6.28-15-generic
qt4-qtconfig linux-headers-2.6.31-17-generic
使用 'apt-get autoremove' 來將其移除。
升級 0 個，新安裝 0 個，移除 0 個，有 0 個未被升級。
Wednesday, April 28, 2010
NanoNote+Arduino Video Clip
David posted an application that using Ben NanoNote pocket computer and Arduino plateform. If you are interested with them, you can aslo see more info from here.
Wednesday, April 21, 2010
Friday, April 9, 2010
New ways of get in touch with Qi Hardware community
David always have incredible promotive idea on pictures, flyers with his artistry.
New ways of get in touch with Qi Hardware community
Monday, January 18, 2010
Tuesday, December 29, 2009
avt2 RC1 reference board
I just posted this specifications on Qi wiki page.
FEATURES
* 336 MHz XBurst Jz4720 MIPScompatible CPU
* display: 8bit RGB / ITU 656/601 data format input of TFT display.
* dimension (mm): 94.5 x 65
* DRAM: 64MB Synchronous DRAM
* headphone jack (3.5 mm)
* SDHC microSD
* support 850mAh charge limited 4.2V Liion battery
* 2GB NAND flash memory
* miniUSB: USB 2.0 HighSpeed Device
* microAB USB: USB 1.1 Host
* serial console
* speaker and microphone
* 58 Keys
Wednesday, December 16, 2009
How to Solder RXD/TXD/GND in Ben NanoNote
This article is for Ben NanoNote's wiki page, you can also check here to know all the info in Qi Hardware's wiki page.
Purposes
One wants to solder [1] extension wires for Ben NanoNote’s serial console test points. Since the Ben has that 3 test points (RXD, TXD & GND), it originally works as TEST POINTs on temporarily experimental or measurable purpose NOT permanently extendable one. Its original trace layout doesn’t allow you to do this under improper soldering method or carelessness. But if you still want to use serial port for a long while, this article can give you some guide lines.
Product
Ben NanoNote
Tool & Material
Soldering Station with a suitable conical type of soldering tip [2]
Soldering Wire 0.5Φ diameter [3]
Wire-Wrapping Wire 30AWG [4]
Multi-function wire stripper [5]
Frequent Failures When Soldering
Condition a, Test points ( Pads ) are broken from pcb surface
Condition b, Trace with Test Point is pull out
Figure 1
With improper soldering method or carelessness, you probably get either both or one of them.Knowledge about Soldering
Since the iron soldering tool can easily let you join two metallic surfaces into one, you need to be careful about your soldering head temperature, how many seconds you use and how about your craftsmanship you have. Before you start to do the following steps, you can also check the physical theory a little bit or ask anyone possessed of senior soldering skills to help you.
Through [1], you can see more soldering articles for your reference. Also you can check here [7] to know HOW TO SOLDER first.
STEPs
A . Soldering Accessories
A 900M-T-1 size of soldering iron tip can be suitable for this process. You can choose a 1 or 3 marked tip as following figure. The marked 2 or 4 is not recommended.
Figure 2
Figure 3
A 0.5mm diameter soldering wire is better.
Figure 4
Also using a 30AWG of wire wrapping wire or equivalent AWG wire is recommended.
Figure 5
Why choose so tiny diameter accessories? Please see next figure then you will easily realize. Unless you are an expertise with great craftsmanship in soldering field, I do really recommend that using them.
Figure 6
B. CLEAN up test points and wires
The TXD (TP75) and RXD (TP74) are shown as below. Or see [8] [9] to understand their location. Clean up the surface of test point and wires first, you can just follow “ 2. SURFACE PREPARATION: CLEAN” instructions of [7] to do this step. Novices can make the mistake of overheating the parts as they try to force the solder to stick. This will usually result in irreversible damage and force you to scrap pads, trace or even BEN Nanonote.
C. Tinning
Contacts of both test points and wires must be tinned before attempt to solder. So now do tinning process on 3 test points and terminal of three wires as next figure as well. Some wire wrapping wire already have been tinned on its surface, you can just use a wire stripper to strip away the tip of the insulation to expose the copper wire within. Otherwise you must lightly coat it with solder. You must also tin the tip of the iron to help conduct heat to the components.
Figure 9
D. Applying Heat and Solder
Before doing this step of real solder you can reference this video [10] to see how solder will be the better. “With the tinned soldering iron in hand, you are now ready to heat the components. Rest the iron tip on both the wire lead and the PCB. It will only take one or two seconds to heat the components up. Once you have heated up the wire and the circuit board, solder can be applied. Touch the tip of the strand of solder to the heated wire lead and the solder pad on the circuit board, but not to the tip of the iron. At this point, the solder will flow freely around the wire lead and the pad. Once the surface of the pad has been completely coated, you must stop adding solder and then, quickly remove the soldering iron. Do not move the newly formed joint for a few seconds until the solder cools down and becomes solid. Moving the joint at this point will cause a formation of a cold joint.”
Figure 10
Clean up again on all soldered area.
E. Clean up
F. Fixed by glue or other adhesive tape
Using any adhesive tape or glue is to protect wire-wrapping wires away from heavy extra-loading forced to bend wires, pull out test points or break trace shown as figure 1. If you’d prefer to use usb power rather than battery, you can just do like as following figure or use adhesive tape to protect those three soldered point.
Figure 11
[1] http://en.wikipedia.org/wiki/Soldering
Ref.
[2] http://www.sparkfun.com/commerce/product_info.php?products_id=619
[3] http://www.senju.com/pages/lead_free_wire.htm
[4] http://cgi.ebay.com/_W0QQcmdZViewItemQQitemZ120478983749
[5] http://www.sparkfun.com/commerce/product_info.php?products_id=8696
[6] http://www.tequipment.net/HakkoCSP30-1.html
[7] http://www.solderinguide.com/
[8] http://wiki.qi-hardware.com/wiki/Serial_console
[9] http://wiki.qi-hardware.com/wiki/File:Ben_nanonote_serial2.jpg
[10] http://vega.org.uk/video/programme/166
Author: adam@qi-hardware.com
Monday, December 14, 2009
Experiment of Ben NanoNote's Charge Cycle
I just edited this at Qi Hardware wiki. So you can also see this article here.
Purpose of Experiment
To understand that how does Ben NanoNote’s charge cycle work.
Test Product
BEN NanoNote
Equipments
Agilent 34401A Multimeter
CHY 48R Multimeter
Methods of Connection
Current connection:
Figure 1
Schematic
Figure 2
State Diagram of a Typical Charge Cycle
Figure 3
Study System Voltage SpecificationBefore this experiment, let’s see how Ben’s design and how to choose low voltage detector first. Because the Ben has jz4720 VDDIO voltage (2.97~3.63V) see page 24 of datasheet [1], the NANAD FLASH K9GAG08U0M has Vcc range (2.7~3.6V), also SDRAM P3V56S40ETP has VDD range (3.0~3.6V). So a low voltage detector circuit that can shut down the cpu jz4720 when monitors Battery’s voltage goes down -VDET (2.94~3.06V) detected by BL8506-30NRM, and the Battery has a over-discharge protect voltage 2.25V.
Figure 4
Through figure 4, we can easily know the best working power voltage for ben should be between upper limited 3.6V of SDRAM and lower limited 3.0V of SDRAM. That’s their intersection. Of course if there’s an sdram with widely working voltage like nand flash at lower 2.7V. That would be good to lengthen discharging time. But then the intersection becomes 2.97V caused by cpu. Since battery cell has overdischarge protect voltage 2.25V, strongly recommended that the software should be possessed of a detector of monitoring battery voltage under 3.0 voltages to make sure sdram can work normally. That’s the reason why ben has a low voltage detector BL8506-30NRM [3] which is based on 3.0±0.06 V detection precision ±2%.
Charge Status Indicator (CHRG), pin1 of SE9016
From its datasheet [2], this pin can output three status: strong pull down(~ 10mA), weak pull down (~20uA) and high impedance. So D3 LED can be as indicator shown if charging or not.
Experimental Data
From SE9016 datasheet [2], when BEN is on Power ON mode (Display On) , PW_ON_N is low; so RPROG = R15 = 10KΩ, from Data collection, IBAT = (VPROG / RPROG ) * 1100, then we can calculate VPROG inversely from measured IBAT.
Before measurement, make sure that the battery is above 3.06V, otherwise the low voltage detects will tell s/w to shut down cpu and will enter POWER OFF mode. This experiment will split into two modes to measure different charge current.
Case a: POWER ON mode, PW_ON_N is low, Display ON, Slow charging
Case b: POWR OFF mode, PW_ON_N is high, Display OFF, Fast charging
We firstly let BEN entered into POWER ON mode to keep the RPROG equaled to 10KΩ, not 2 KΩ. (if enters POWER OFF mode, the high PW_ON_N will let Q3 TM2302FN turned on then RPROG is R14//R15. see figure 2). From the measured data [4] or figure 5 and 6. The data is a result that starts from 3.6V battery and charges it until ascending theoretically preset 4.2V charge voltage with ±1% accuracy thus 4.158V. Experimentally a 4.145V measured. When the bat pin approaches the final float voltage (4.2V), the SE9016 enters constant-voltage mode and the charge current begins to decrease. We can realize it needs 16.8 hrs from 3.6V to 4.2V.
Figure 5
Figure 6
There’s a voltage called “overdischarge protect/preventing voltage” for lithium-based battery. After measured Ben’s descendant voltage during its discharging, a 2.3V measured then battery inside turn off its output voltage to 0V. This is within its specification 2.25~2.35V. So can let Ben’s SE9016 acted as following figure.
Figure 7
Once VBAT > 2.8V and VPROG > 100mV, SE9016 charges as next figure which is stated in CC/CV mode.
Figure 8
Now let Ben entered to POWER OFF mode to keep the RPROG equaled to 2 KΩ. (R14//R15. see figure 2). From the measured data [4] or figure 9 and 10. The data is a result that starts from 3.2V battery and charges it until ascending preset 4.2V charge voltage with ±1% accuracy thus 4.158V. Experimentally a 4.135V measured. It needs 2.68 hrs from 3.2V to 4.135V. Afterwards, SE9016 enters constant-voltage (CV) mode and the current begins to decrease. The plot of figure 7 & 8 doesn’t include data of CV mode.
Figure 9
Figure 10
The standby mode of SE9016 didn’t experiment. Also see figure 8 in blue flow. To manually restart a charge cycle when in standby mode, the input voltage ( usb power ) must be removed and reapplied or the charger must be shut down and restarted using the PROG pin.This result of experiment may be based on unique battery applied and referenced. You can also find this standard battery technology in many other devices. Ben batteries share the characteristics common to lithium-based technology in other devices. Like other rechargeable batteries, these batteries may eventually require replacement.
[1]http://downloads.qi-hardware.com/hardware/qi_avt2/v1.0/datasheet/U1~Jz4720_ds.pdf
[2]http://downloads.qi-hardware.com/hardware/qi_avt2/v1.0/datasheet/U5~SE9016.pdf
[3]http://downloads.qi-hardware.com/hardware/qi_avt2/v1.0/datasheet/U7~BL8506-30NRM.pdf
[4]http://downloads.qi-hardware.com/hardware/qi_lb60/report/charge_cycle/data.ods
[5]http://www.mpoweruk.com/chargers.htm#rates
[6]鋰電池的守護神---鋰電池保護IC的重要性
Author: mailto:adam@qi-hardware.com
Tuesday, December 8, 2009
Selling avt2 board from Qi Hardware Inc.
If you like linux world, also includes Ingenic jz4720 CPU, USB host/device, 64MB SDRAM, 2GB Flash with serial console connector which can let you access to and from laptop, then you can buy this avt2 reference board.
You can get all open sources here:
* software
* hardware, schematic, pcb files, gerber files
Having this avt2 board, you can participate with the development of Qi Hardware Inc. next product.
Monday, December 7, 2009
How to Playcement and Layout Bypass Capacitor Sequencing with Vils
Bypass Capacitor is used to bypass the power supply or other high impedance component of a circuit. I found that any through vils applied in board design, you must to know what the signal you want to let it pass through and what signals you want to eliminate as more as possible. For example, there's a capacitor needed placement as close as LCD FPC connector with 10uF/10V. but how you route the trace on board?
The above placements of vils are not perfect. You can see the descriptions of bypass capacitor first.Then you can check Parasitic Inductance of Bypass Capacitor II to know what's relationship between your vils with your bypass capacitor? and how's the parasitic inductance of bypass capacitor?
Putting aside the very basics of the theory, let us use the simplest principles of the road point of view, in the end the diameter of vil how we choose? First of all, if one has a four-lane highway through the lane, and then an A at suddenly reduced to two lanes of carriageway; but through the B Division turned back after the four-lane carriageway, what will it happen? A result, will be have traffic jam phenomenon before entering the A, but once through A then becomes smooth into two lanes. After a B point, the phenomenon of traffic congestion would not occur again.
Back to the original topic, if the bypass capacitor connected to vil which its circumference range as long as alike AB, and then also if the original trace width and following trace width is inconsistent, there will be unintended consequences.
If track width is 0.0118", then the both terminal side of each wire trace, the vils should bigger than track width;
for example:
track width = 0.0315",
through vil's diameter = 0.0118"
then the length of the circumference (c) = 2 * 3.141592 * ( 0.0118 / 2 ) = 0.037"
since we are not sure normally the quality on processing vils on pcb maker, so the most safe way is to put 2 pcs of 0.0118" through vil (total equivalent width = 0.037 * 2 = 0.074) on the two ends of trace.
From above illustration, you can see either 2πr is shorter than layer 1 trace width or layer 2 trace width, you will have a wrong choose on vil width type or amount of vils.
Let's go back a little bit of theory side, please reference to this in advance. Through it, in general, if you want to have an overall quick view, you can watch its Index by Keyword for your like hand book.
To be continued.
Ref. : PCB LAYOUT AUTHORITY
Let's go back a little bit of theory side, please reference to this in advance. Through it, in general, if you want to have an overall quick view, you can watch its Index by Keyword for your like hand book.
To be continued.
Ref. : PCB LAYOUT AUTHORITY
Thursday, December 3, 2009
Qi Hardware Inc. has Kicad version reference design
Qi Hardware Inc. just finished pcb and gerber files used by Kicad free tool, i am double checking these great results. You can see here to know all of them.
Ben Nanonote Taking Fun with Games
It's really great news that Ben Nanonote now can play games, you can see here, thanks to David & XiangFu. In the future, maybe Ben Nanonote can be as a portable game player once wifi module runs stable. You can also go to official site here to see it.
Wednesday, December 2, 2009
charging questions on ben nanonote
i sent an email to list for asking following questions, also you can see the following reply messages here.
------------------------------------------------------------------------------------------------------------------------------------
When I measured Ben's charging circuit, I have some questions for s/w hacker:
a) how kernel know that the battery charging if done or in charing?
Using ADIN0 (pin 92) of jz4720 to check voltage of VBAT? this pin is directly connected to battery cell.
If you use this to judge, how you manage s/w to shut down ben when battery's voltage goes down under 2.94V?
you can see [1] &[2], to know SHUTDOWN (GPD6) can tell cpu when components U7 [3] found there's a low voltage detected,
so means that you may need to do something on software to do store & save tasks then turn off device.
b) has anyone used net name called "CHARGE_N" thus GPC27 (pin 69) of jz4720?
what status did you initial this pin? input or output? have any help to you?
Why I asked these questions? Please see [4],
ch1 = CHARGE_N / GPC27 of jz4720 ch2 = pin 1 of U5 SE9016I am thinking that using this "CHARGE_N" pin(GPC27) [5] as input then you can let cpu known the status if charging is done or not by h/w, not judge only by ADIN0; so then maybe you can code an icon at UI to let user know that the device is at usb charging mode or battery mode.
Sorry I don't know s/w side. Thanks a lot.
Adam
[1] http://downloads.qi-hardware.
[2] http://downloads.qi-hardware.
[3] http://downloads.qi-hardware.
[4] http://downloads.qi-hardware.
[5] http://wiki.qi-hardware.com/
Tuesday, December 1, 2009
Easy Book 上網通GL-740
最近有人傳這個Easy Book 上網通GL-740 資訊給我, 其實我在 Shenzhen 時已經看到很多這類產品; 大陸都稱它為"上網本"; 超輕的, 只有 0.68Kg; 跟 Qi Hardware Inc. 的產品有類似喔!!! 但 Qi Hardware 的 Ben Nanonote 是要外掛 MicroSD wifi module 才可上網, 但都是用 Ingenic 的 CPU.
Some waveforms about Ben Nanonote of Qi Hardware Inc.
I just curious on Ben Nanonote h/w, so I took some waveforms on its board. For much understanding that h/w behaviour, so collected some waveforms about Ben Nanonote and avt2 reference board. You can refer to here [1] to know. Since the avt2 board [2] is the reference developed from with Ben, you can directly check [3] for your reference, taking them you may easily understand how Ben works like power on or off sequences.
[1] http://downloads.qi-hardware.
[2] http://downloads.qi-hardware.
[3] http://downloads.qi-hardware.
Friday, November 20, 2009
How to confirm if NAND Flash has inside wrong data (h/w issue) or s/w issue
I tried to fix a board called avt2 V1.0. It shows "cannot get kernel image" after boot loader finished run. It uses:
a) 2GB Nand flash
b) 64MB SDRAM
c) Ingenic jz4720 CPU
the test s/w is done by Carlos Carmago. XinagFu tought me that the allocation of nand flash is as below,
# 4M 4M 504 1.5G
#|-----------------|-------------|----------------|--------------------------|
#|u-boot |kernel | rootfs | data |
The commands for scripts are:
KERNEL=./uImage
sudo usbboot -f ./usbboot_2gb_nand_64M.cfg -c "boot;nprog 0 u-boot-nand.bin 0 0 -n"
sudo usbboot -f ./usbboot_2gb_nand_64M.cfg -c "nprog 1024 uImage 0 0 -n"
After running scripts, it always shows "cannot get image kernel". This image size is around 1.8MB, we tried to use:
nand erase 0
but this command didn't find any fault. And reflash avt2 again, it still cannot get kernel. So we firstly thought it was an unstable image kernel to cause that. So we reflashed it by XiangFu's codes. His kernel is around 1.5MB. Then it all worked well. So that was really confused us. Because same board with different image kernel but got different results. Especially XiangFu's kernel worked fine. Also then we thought might be have h/w issue on flash itself but we didn't know exactly. Because stage 1 and stage 2 were working well. This means the address and data bus of nand flash are physically connected to cpu and sdram well. So this must be somewhere inside flash defectively. Then XiangFu suggested me to use another avt2 board with same s/w. Then we found that one was totally work perfect. So he suggested that we needed to try to think that can we just moved image kernel shift move a little bit inside flash to see what will it happen. So we changed command as following:
sudo usbboot -f ./usbboot_2gb_nand_64M.cfg -c "nprog 512 uImage 0 0 -n"
and set boot evironment args into nand as following:
setenv bootcmd nand read 0x80600000 0x200000 0x200000\;bootm
Then the root cause was found, it run well and can get kernel image. This approved that there might some pages defective around between 5.5MB and 5.8MB inside of flash.
Also there's an easy way to measure how many resistor between V33 and GND pins, the normal value will be around 170K ohm. But if your this board have defective nand flash, sometimes the value will be very lower than 20K ohm.
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